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Edvard König's love for woodwork and modern computer technologies and is named after the Latin translation of the word "wood." A perfect symbiosis of the oldest natural building material and contemporary high-end cooling solutions. We can't wait for players, both old and new, to see how we've elevated the original experience in the remake to be just as impactful for this generation."ĮK, the leading premium liquid cooling gear manufacturer, announces new signature CPU water blocks - EK-Quantum Velocity² and EK-Quantum Magnitude Lignum edition. "We're making great progress on our road to hitting Alpha and we're happy to announce that the game will be launching in January next year. It's been equally exciting to see players' reactions as we're taking them on this development journey with us," said Phillippe Ducharme, Senior Producer of Dead Space. "Developing this remake has been a lot of fun for us at Motive, as we're true fans of the franchise and want to treat it with the respect it deserves. Still remaining true to the original game's thrilling vision, the remake offers enhanced audio and crisp, harrowing visuals that have been carefully reimagined to evoke a new level of immersion and quality. Dead Space is a remake of the classic sci-fi survival horror game that is being rebuilt from the ground up leveraging the Frostbite game engine.
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(NASDAQ: EA) today announced during their Crafting the Tension Art Developer Livestream that Dead Space will officially launch on Janufor PlayStation 5, Xbox Series X|S and PC. Also, much like FSR, XeSS will be open to GPUs from other brands. XeSS appears to work similar to AMD FSR 2.0, with its upscaler using motion-vectors and temporal data from the game engine to reconstruct details in the outbound frames. XeSS will play a particularly big role in Intel's plans to grab a slice of the gaming graphics market with its Arc "Alchemist" discrete GPUs. Much like FSR and DLSS, XeSS works with a supported game to render raster 3D scenes at a lower resolution than the display resolution, and upscales them using a sophisticated algorithm that minimizes image quality loss, with a net gain in frame-rates. This would mean Intel Graphics has a driver release planned very soon, for its Xe LP-based iGPUs and Iris Xe MAX discrete GPU as well as the first round of Arc 3 "Alchemist" mobile graphics, which will launch with XeSS support.

This matches our report from March 2022 that referenced an "early Summer" debut.
#AMD SATA CONTROLLER DRIVER WINDOWS 10 DOWNLOAD PATCH#
The ambitious performance enhancement by Intel Graphics rivaling NVIDIA DLSS and AMD FSR, the Intel XeSS (Xe Super Sampling,) will debut on May 20, 2022, with a patch for "Dolmen," developer Massive Work Studio announced. The first BiCS+ NAND will be for datacenter products and WD claims that their first product should see a 60 percent increase in transfer speeds, a 15 percent increase in program bandwidth and a 55 percent increase in bit growth per wafer over the current BiCS6 NAND. The roadmap stretches all the way to 2032, when we should apparently be seeing 500-layer NAND flash, assuming everything goes according to plan. The two are only planning what they call BiCS+ at over 200-layers for 2024, which is well over a year behind Micron. Although Western Digital and Kioxia claim to have to invest less to increase their capacity, it would appear that they're behind the competition when it comes to the amount of layers they can stack. The slide provided by WD claims a 20 MB/s lead of the competition at 60 MB/s vs. Although it's not something we can verify, WD claims to have the world's best charge trap cell, which the company claims leads to higher performance compared to its competitors. In its presentation, WD listed a single wafer capacity of 100 TB, which is an increase from around 70 TB per wafer in 2020. WD claims that their die size is smaller than the competition, which could be an advantage due to more dies per wafer. Most of their competitors are already at 176-layer stacks, although WD and Kioxia still deliver the same capacity NAND chips as its competitors. This year the two companies will move to its sixth generation of BiCS NAND which is stacking 162-layers of NAND flash. The different NAND flash manufacturers use similar, but far from identical ways to manufacture their NAND flash and WD is working together with Kioxia and the two are using a process called bit column stacked or BiCS NAND. Last week, Micron revealed its NAND flash plans and so did Western Digital during its investors day.
